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Online Library TheLib.net » Author books / Книги автора John H. Lau

book Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

epub

Author: John H. Lau
Language: English
Year: 2023

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01.03.2024

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book Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

pdf

Author: John H. Lau
Language: English
Year: 2023

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15.02.2024

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book Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints

pdf

Author: John H. Lau Ning-Cheng Lee
Language: English
Year: 2020

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07.02.2024

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book Heterogeneous Integrations

Heterogeneous Integrations

pdf

Author: John H. Lau
Language: English
Year: 2019

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30.01.2024

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book Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

pdf

Author: John H. Lau
Language: English
Year: 2018

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29.01.2024

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book Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

pdf

Author: John H. Lau (auth.) John H. Lau PhD PE (eds.)
Language: English
Year: 1993

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27.01.2024

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book Solder Joint Reliability: Theory and Applications

Solder Joint Reliability: Theory and Applications

pdf

Author: Colin MacKay (auth.) John H. Lau (eds.)
Language: English
Year: 1991

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27.01.2024

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book Electronics Packaging Forum: Volume Two

Electronics Packaging Forum: Volume Two

pdf

Author: John H. Lau Steve J. Erasmus Donald W. Rice (auth.) James E. Morris (eds.)
Language: English
Year: 1990

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27.01.2024

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book Advanced MEMS packaging

Advanced MEMS packaging

pdf

Author: John H. Lau ... [et al.]
Language: English
Year: 2010

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27.01.2024

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book Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

djvu

Author: John H. Lau
Language: English
Year: 2000

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27.01.2024

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