Ebook: Electronics Packaging Forum: Volume Two
- Tags: Electronics and Microelectronics Instrumentation, Physics general
- Year: 1990
- Publisher: Springer Netherlands
- Edition: 1
- Language: English
- pdf
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Content:
Front Matter....Pages i-viii
An Introduction to Tape Automated Bonding Technology....Pages 1-83
Stress Analysis for Component-Populated Circuit Cards....Pages 85-102
Modeling Concepts for the Vibration Analysis of Circuit Cards....Pages 103-137
Power Technology Packaging for the 90s....Pages 139-181
Recent Developments in Thermal Technology for Electronics Packaging....Pages 183-208
Heat Sinks in Forced Convection Cooling....Pages 209-228
Diamond Thin Films: Applications in Electronics Packaging....Pages 229-245
Low Dielectric Constant Materials for Packaging High Speed Electronics....Pages 247-280
Integrated Optical Devices Based on Silica Waveguide Technology....Pages 281-295
Electrostatic and Electrical Overstress Damage in Silicon Mosfet Devices and Gaas Mesfet Structures....Pages 297-333
Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113....Pages 335-361
Electrical Bonding of Connectors on Jet Engine Electronics....Pages 363-394
Parameterization of Fine Pitch Processing....Pages 395-436
Microelectronics Packaging/Interconnect: An Industry in Transition....Pages 437-449
Back Matter....Pages 451-459
Content:
Front Matter....Pages i-viii
An Introduction to Tape Automated Bonding Technology....Pages 1-83
Stress Analysis for Component-Populated Circuit Cards....Pages 85-102
Modeling Concepts for the Vibration Analysis of Circuit Cards....Pages 103-137
Power Technology Packaging for the 90s....Pages 139-181
Recent Developments in Thermal Technology for Electronics Packaging....Pages 183-208
Heat Sinks in Forced Convection Cooling....Pages 209-228
Diamond Thin Films: Applications in Electronics Packaging....Pages 229-245
Low Dielectric Constant Materials for Packaging High Speed Electronics....Pages 247-280
Integrated Optical Devices Based on Silica Waveguide Technology....Pages 281-295
Electrostatic and Electrical Overstress Damage in Silicon Mosfet Devices and Gaas Mesfet Structures....Pages 297-333
Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113....Pages 335-361
Electrical Bonding of Connectors on Jet Engine Electronics....Pages 363-394
Parameterization of Fine Pitch Processing....Pages 395-436
Microelectronics Packaging/Interconnect: An Industry in Transition....Pages 437-449
Back Matter....Pages 451-459
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