Ebook: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, and learn how to choose a cost-effective design and reliable, high-yield manufacturing process for your interconnect systems as you explore...

*IC trends and packaging technology updates *Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys *Sequential build up PCB with microvias and via-in-pad *How to select underfill materials *And much, much more!