Book serie: / Книги серии: Series on Advanced Electronic Packaging Technology and Key Materials » Online Library TheLib.net

Online Library TheLib.net » Book serie: / Книги серии: Series on Advanced Electronic Packaging Technology and Key Materials

book Advanced Polyimide Materials: Synthesis, Characterization, and Applications

Advanced Polyimide Materials: Synthesis, Characterization, and Applications

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Author: Shi-Yong Yang
Language: English
Year: 2018

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15.02.2024

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book High Temperature Electronics

High Temperature Electronics

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Author: F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski (eds.)
Language: English
Year: 1997

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29.01.2024

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book Guidebook for Managing Silicon Chip Reliability

Guidebook for Managing Silicon Chip Reliability

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Author: Pecht Michael, Radojcic Riko, Rao Gopal
Language: English
Year: 2017

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29.01.2024

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book Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties

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Author: Michael Pecht Rakish Agarwal F. Patrick McCluskey Terrance J. Dishongh Sirus Javadpour Rahul Mahajan
Language: English
Year: 1999

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29.01.2024

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book Essentials of electronic packaging : a multidisciplinary approach

Essentials of electronic packaging : a multidisciplinary approach

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Author: Puligandla Viswanadham Dereje Agonafer
Language: English
Year: 2011

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29.01.2024

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book Essentials of electronic packaging : a multidisciplinary approach

Essentials of electronic packaging : a multidisciplinary approach

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Author: Puligandla Viswanadham Dereje Agonafer
Language: English
Year: 2011

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28.01.2024

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book Thermal management of telecommunications equipment

Thermal management of telecommunications equipment

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Author: Chu Richard C., Yeh Lian-Tuu
Language: English
Year: 2013

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28.01.2024

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book Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices

Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices

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Author: Lian-Tuu Yeh Richard C. Chu Dereje Agonafer
Language: English
Year: 2002

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27.01.2024

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book Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

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Author: Dean L. Monthei (auth.)
Language: English
Year: 1999

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27.01.2024

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book High-Frequency Characterization of Electronic Packaging

High-Frequency Characterization of Electronic Packaging

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Author: Luc Martens (auth.)
Language: English
Year: 1998

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27.01.2024

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