Ebook: High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials

Mechanical engineering, an engineering discipline born of the needs of the industrial revolution, is once again asked to do its substantial share in the call for industrial renewal. The general call is urgent as we face profound issues of productivity and competitiveness that require engineering solutions, among oth­ ers. The Mechanical Engineering Series features graduate texts and research monographs, intended to address the need for information in contemporary areas of mechanical engineering. The series is conceived as a comprehensive one the will cover a broad range of concentrations important to mechanical engineering graduate education and research. We are fortunate to have a distinguished roster of consulting editors, each an expert in one of the areas of concentration. The names of the consulting editors are listed on the first page of the volume. The areas of concentration are applied mechanics, biomechanics, computational mechanics, dynamic systems and control, energetics, mechanics of materials, processing, thermal science, and tribology. Professor Winer, the consulting editor for applied mechanics and tribology, and I are pleased to present this volume of the series: High Sensitivity Moire: Experimental Analysis for Mechanics and Materials by Professor Post, Dr. Han and Dr. Ifju. The selection of this volume underscores again the interest of the Mechanical Engineering Series to provide our readers with topical monographs as well as graduate texts.

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This book describes both the theory and practice of physical measurements that use high-sensitivity moire - principally moire interferometry. Its focus is on the mechanics and micromechanics of materials and structural elements. Unlike both classical and holographic interferometry, which are best suited for out-of-plane deformation measurements, moire interferometry provides whole-field maps of the in-plane displacements. Normal strains and shear strains are derived directly from the in-plane data. Moire with 2400 lines per mm is typical in practice, yielding a sensitivity of 2.4 moire fringes per micron of displacement. For micromechanics, sensitivity corresponding to 17 nm per fringe contour is demonstrated. Part II is devoted to applications of moire interferometry and microscopic moire interferometry. New studies, not previously published, are included. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. The methods can be applied for whole-field measurements on nearly and solid body. This reader-friendly book should serve engineers and scientists who are concerned with measurements of real phenomena - and it should stimulate students to pursue the treasures of experimental analysis.

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This book describes both the theory and practice of physical measurements that use high-sensitivity moire - principally moire interferometry. Its focus is on the mechanics and micromechanics of materials and structural elements. Unlike both classical and holographic interferometry, which are best suited for out-of-plane deformation measurements, moire interferometry provides whole-field maps of the in-plane displacements. Normal strains and shear strains are derived directly from the in-plane data. Moire with 2400 lines per mm is typical in practice, yielding a sensitivity of 2.4 moire fringes per micron of displacement. For micromechanics, sensitivity corresponding to 17 nm per fringe contour is demonstrated. Part II is devoted to applications of moire interferometry and microscopic moire interferometry. New studies, not previously published, are included. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. The methods can be applied for whole-field measurements on nearly and solid body. This reader-friendly book should serve engineers and scientists who are concerned with measurements of real phenomena - and it should stimulate students to pursue the treasures of experimental analysis.
Content:
Front Matter....Pages i-xxi
Introduction....Pages 1-6
Front Matter....Pages 7-7
Elements of Optics....Pages 9-83
Geometric Moir?....Pages 85-133
Moir? Interferometry....Pages 135-226
Microscopic Moir? Interferometry: Very High Sensitivity....Pages 227-255
On the Limits of Moir? Interferometry....Pages 257-269
Front Matter....Pages 271-271
Laminated Composites in Compression: Free-edge Effects....Pages 273-292
Thermal Stresses Near the Interface of a Bimaterial Joint....Pages 293-312
Textile Composites....Pages 313-329
Thermal Deformations in Electronic Packaging....Pages 331-347
Advanced Composites Studies....Pages 349-367
Metallurgy, Fracture, Dynamic Loading....Pages 369-389
Strain Standard for Calibration of Electrical Strain Gages....Pages 391-417
Back Matter....Pages 419-445

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This book describes both the theory and practice of physical measurements that use high-sensitivity moire - principally moire interferometry. Its focus is on the mechanics and micromechanics of materials and structural elements. Unlike both classical and holographic interferometry, which are best suited for out-of-plane deformation measurements, moire interferometry provides whole-field maps of the in-plane displacements. Normal strains and shear strains are derived directly from the in-plane data. Moire with 2400 lines per mm is typical in practice, yielding a sensitivity of 2.4 moire fringes per micron of displacement. For micromechanics, sensitivity corresponding to 17 nm per fringe contour is demonstrated. Part II is devoted to applications of moire interferometry and microscopic moire interferometry. New studies, not previously published, are included. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. The methods can be applied for whole-field measurements on nearly and solid body. This reader-friendly book should serve engineers and scientists who are concerned with measurements of real phenomena - and it should stimulate students to pursue the treasures of experimental analysis.
Content:
Front Matter....Pages i-xxi
Introduction....Pages 1-6
Front Matter....Pages 7-7
Elements of Optics....Pages 9-83
Geometric Moir?....Pages 85-133
Moir? Interferometry....Pages 135-226
Microscopic Moir? Interferometry: Very High Sensitivity....Pages 227-255
On the Limits of Moir? Interferometry....Pages 257-269
Front Matter....Pages 271-271
Laminated Composites in Compression: Free-edge Effects....Pages 273-292
Thermal Stresses Near the Interface of a Bimaterial Joint....Pages 293-312
Textile Composites....Pages 313-329
Thermal Deformations in Electronic Packaging....Pages 331-347
Advanced Composites Studies....Pages 349-367
Metallurgy, Fracture, Dynamic Loading....Pages 369-389
Strain Standard for Calibration of Electrical Strain Gages....Pages 391-417
Back Matter....Pages 419-445
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