Ebook: Metallized Plastics 3: Fundamental and Applied Aspects

This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor.

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Metallization Techniques and Properties of Metal Deposits: PlasmaInduced Deposition of Copper Films (R. Padiyath et al.). Development of a Generic Method to Metallize Plastic (T.A. Reddy et al.). Investigation of Interfacial Interactions: Model Studies of the Interface between Metals and Polyimides (W.N. Unertl, R.G. Mack). Model Systems for the Cr/Polyimide Interface (A. Selmani et al.). Plastic Surface Modifications: A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment (R.J. Mammone et al.). Aluminum Metallization of Polyimide Substrate (J.K. Lin, N.C. Saha). Adhesion Aspects of Metallized Plastics: Adhesion Enhancement Using Ion Processing (A.A. Galuska). The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics (D. Mann et al.). 20 additional articles. Index.

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Metallization Techniques and Properties of Metal Deposits: PlasmaInduced Deposition of Copper Films (R. Padiyath et al.). Development of a Generic Method to Metallize Plastic (T.A. Reddy et al.). Investigation of Interfacial Interactions: Model Studies of the Interface between Metals and Polyimides (W.N. Unertl, R.G. Mack). Model Systems for the Cr/Polyimide Interface (A. Selmani et al.). Plastic Surface Modifications: A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment (R.J. Mammone et al.). Aluminum Metallization of Polyimide Substrate (J.K. Lin, N.C. Saha). Adhesion Aspects of Metallized Plastics: Adhesion Enhancement Using Ion Processing (A.A. Galuska). The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics (D. Mann et al.). 20 additional articles. Index.
Content:
Front Matter....Pages i-ix
Front Matter....Pages 1-1
The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards....Pages 3-8
Photoselective Circuitization of Dielectrics Via Electroless Plating Of Metals....Pages 9-17
Plasma-Induced Deposition of Copper Films....Pages 19-27
The Effects of Substrate Functional Groups on Conventional and Novel Electroless Catalysts....Pages 29-41
Laser Speckle Detection of Surface Morphology in Molded Plastic Parts....Pages 43-55
Development of a Generic Method to Metallize Plastics....Pages 57-63
Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates From Organometallic Complexes....Pages 65-72
Application of Metallized Plastic Electrodes for Electrowinning of Metals....Pages 73-82
Front Matter....Pages 83-83
Model Studies of the Interface Between Metals and Polyimides....Pages 85-108
Scanning Tunneling Microscopy of Metal/Polymer Interfaces....Pages 109-121
“In Situ” XPS Investigation of Polymers Metallized by Evaporation....Pages 123-140
Model Systems for the Cr/Polyimide Interface....Pages 141-148
Interactions of Deposited Copper on COOH of 11-Mercaptoundecanoic Acid: An XPS Study....Pages 149-161
XPS Investigation of the Interfacial Chemistry of Evaporated Silver on Plasma-Modified Polystyrene....Pages 163-178
The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion....Pages 179-193
Front Matter....Pages 195-195
A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment....Pages 197-200
Influence of Surface Treatments on The Metallization of Thermostable Polymers....Pages 201-213
Oxygen Plasma Treatment of Fluorinated Polyimide: An X-Ray Photoelectron Spectroscopy Study....Pages 215-223
A Static SIMS Study of the Chemical Modifications Induced by Plasma and Flame Treatments at the Surface of Polyolefins....Pages 225-241
Aluminium Metallization of Polypropylene Films Pretreated by a N2 or NH3 Nonequilibrium Plasma. Study of the Interface and Adhesion Measurements....Pages 243-256
Front Matter....Pages 195-195
Aluminum Metallization of Polyimide Substrate....Pages 257-264
Front Matter....Pages 265-265
Adhesion Enhancement Using Ion Processing: Metallized Plastics....Pages 267-293
The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics....Pages 295-302
Effect of the Polymeric Substrate Temperature on the Adhesion and Morphology of Metal Layers....Pages 303-318
An Electrochemical Means of Probing a Metal/Polymer Interface— a Method for Deducing Mechanical and Chemical Adhesion Components....Pages 319-330
Measurement and Control of Interface Strength and Mechanical Properties of Coatings by Laser Spallation Experiment....Pages 331-345
The Adhesion Strength of Metal/Polyimide and Polyimide /Silicon Interfaces as Determined by the Blister Test....Pages 347-364
Non-Destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy....Pages 365-383
Back Matter....Pages 385-400

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Metallization Techniques and Properties of Metal Deposits: PlasmaInduced Deposition of Copper Films (R. Padiyath et al.). Development of a Generic Method to Metallize Plastic (T.A. Reddy et al.). Investigation of Interfacial Interactions: Model Studies of the Interface between Metals and Polyimides (W.N. Unertl, R.G. Mack). Model Systems for the Cr/Polyimide Interface (A. Selmani et al.). Plastic Surface Modifications: A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment (R.J. Mammone et al.). Aluminum Metallization of Polyimide Substrate (J.K. Lin, N.C. Saha). Adhesion Aspects of Metallized Plastics: Adhesion Enhancement Using Ion Processing (A.A. Galuska). The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics (D. Mann et al.). 20 additional articles. Index.
Content:
Front Matter....Pages i-ix
Front Matter....Pages 1-1
The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards....Pages 3-8
Photoselective Circuitization of Dielectrics Via Electroless Plating Of Metals....Pages 9-17
Plasma-Induced Deposition of Copper Films....Pages 19-27
The Effects of Substrate Functional Groups on Conventional and Novel Electroless Catalysts....Pages 29-41
Laser Speckle Detection of Surface Morphology in Molded Plastic Parts....Pages 43-55
Development of a Generic Method to Metallize Plastics....Pages 57-63
Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates From Organometallic Complexes....Pages 65-72
Application of Metallized Plastic Electrodes for Electrowinning of Metals....Pages 73-82
Front Matter....Pages 83-83
Model Studies of the Interface Between Metals and Polyimides....Pages 85-108
Scanning Tunneling Microscopy of Metal/Polymer Interfaces....Pages 109-121
“In Situ” XPS Investigation of Polymers Metallized by Evaporation....Pages 123-140
Model Systems for the Cr/Polyimide Interface....Pages 141-148
Interactions of Deposited Copper on COOH of 11-Mercaptoundecanoic Acid: An XPS Study....Pages 149-161
XPS Investigation of the Interfacial Chemistry of Evaporated Silver on Plasma-Modified Polystyrene....Pages 163-178
The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion....Pages 179-193
Front Matter....Pages 195-195
A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment....Pages 197-200
Influence of Surface Treatments on The Metallization of Thermostable Polymers....Pages 201-213
Oxygen Plasma Treatment of Fluorinated Polyimide: An X-Ray Photoelectron Spectroscopy Study....Pages 215-223
A Static SIMS Study of the Chemical Modifications Induced by Plasma and Flame Treatments at the Surface of Polyolefins....Pages 225-241
Aluminium Metallization of Polypropylene Films Pretreated by a N2 or NH3 Nonequilibrium Plasma. Study of the Interface and Adhesion Measurements....Pages 243-256
Front Matter....Pages 195-195
Aluminum Metallization of Polyimide Substrate....Pages 257-264
Front Matter....Pages 265-265
Adhesion Enhancement Using Ion Processing: Metallized Plastics....Pages 267-293
The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics....Pages 295-302
Effect of the Polymeric Substrate Temperature on the Adhesion and Morphology of Metal Layers....Pages 303-318
An Electrochemical Means of Probing a Metal/Polymer Interface— a Method for Deducing Mechanical and Chemical Adhesion Components....Pages 319-330
Measurement and Control of Interface Strength and Mechanical Properties of Coatings by Laser Spallation Experiment....Pages 331-345
The Adhesion Strength of Metal/Polyimide and Polyimide /Silicon Interfaces as Determined by the Blister Test....Pages 347-364
Non-Destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy....Pages 365-383
Back Matter....Pages 385-400
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