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This volume chronicles the proceedings of the Symposium on Particles on Surfaces: Detection, Adhesion and Removal held under the auspices of the Fine Particle Society in San Francisco, July 28-August 2, 1986. The study of particles on surfaces is extremely important in many areas of human endeavor (ranging from microelectronics to optics to biomedical). A complete catalog of modern precision and sophisticated technologies where particles on surfaces are of cardinal importance will be prohibitively long, but the following eclectic examples should underscore the concern about particles on a variety of surfaces. In the semiconductor world of shrinking dimensions, particles which, a few years ago, were cosmetically undesirable but functionally innocuous can potentially be killer defects now. As the device sizes get smaller, there will be more and more concern about smaller and smaller particles. In the information storage technology, the gap between the head and the disk is very narrow, and if a particle is trapped in the gap that can have very grave consequences. The implications of particulate contamination on sensitive optical surfaces is all too manifest. So the particulate contamination on surfaces is undesirable from functional, yield and reliability points of view. This symposium was organized with the following objectives in mind: to bring together active practitioners in this field; to provide a forum for discussion of the latest research and development activities in this area; to provide opportunity for cross-pollination of ideas; and to highlight topics which needed intensified effort.








Content:
Front Matter....Pages i-ix
Front Matter....Pages 1-1
Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry....Pages 3-16
Cleaning Semiconductor Surfaces: Facts and Foibles....Pages 17-35
Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers....Pages 37-42
Measuring Aerosol Particle Concentration in Clean Rooms and Particle areal Density on Silicon Wafer Surfaces....Pages 43-56
Particulate Contamination on Wafer Surfaces Resulting from Hexamethyldisilazane/Water Interactions....Pages 57-68
Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices....Pages 69-76
Calculation of Hamaker Coefficients for Metallic Aerosols from Extensive Optical Data....Pages 77-90
Soiling Mechanisms and Performance of Anti-Soiling Surface Coatings....Pages 91-111
Implications of Particulate Contamination in the Performance of Floppy Disks....Pages 113-125
Front Matter....Pages 127-127
A Theoretical Review of Particle Adhesion....Pages 129-142
The Electrostatic Force on a Dielectric Sphere Resting on a Conducting Substrate....Pages 143-155
Electrostatic Charge Generation on Wafer Surfaces and its Effect on Particulate Deposition....Pages 157-168
Toner Adhesion in Electrophotography....Pages 169-177
Adhesion and Removal of Particles: Effect of Medium....Pages 179-191
Strong Adhesion of Dust Particles....Pages 193-199
Prevention of Strong Adhesion of Dust Particles....Pages 201-210
Dynamic Adhesion of Particles Impacting a Cylinder....Pages 211-224
Crossed Fiber Models of the Particle-Surface Interaction....Pages 225-236
Sensitive New Method for the Determination of Adhesion Force Between a Particle and a Substrate....Pages 237-243
Front Matter....Pages 245-245
Detection of Particles on Clean Surfaces....Pages 247-251
Front Matter....Pages 245-245
Detection of Particles Down to a “Few” Micrometers on Non-Specular Microelectronic Substrates and Other Surfaces....Pages 253-267
Accurate Particle Counting for Bare Substrate Inspection....Pages 269-291
Automated SEM/EDS Image Analysis of Particles on Filter Blanks....Pages 293-306
Particle Sizing and Counting with the Inspex EX20/20....Pages 307-326
Front Matter....Pages 327-327
Methods for Surface Particle Removal: A Comparative Study....Pages 329-338
Electrostatic Removal of Particles from Surfaces....Pages 339-349
Electric Field Detachment of Charged Particles....Pages 351-360
A New Approach to the Removal of Sub-Micron Particles from Solid (Silicon) Substrates....Pages 361-372
Back Matter....Pages 373-384



Content:
Front Matter....Pages i-ix
Front Matter....Pages 1-1
Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry....Pages 3-16
Cleaning Semiconductor Surfaces: Facts and Foibles....Pages 17-35
Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers....Pages 37-42
Measuring Aerosol Particle Concentration in Clean Rooms and Particle areal Density on Silicon Wafer Surfaces....Pages 43-56
Particulate Contamination on Wafer Surfaces Resulting from Hexamethyldisilazane/Water Interactions....Pages 57-68
Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices....Pages 69-76
Calculation of Hamaker Coefficients for Metallic Aerosols from Extensive Optical Data....Pages 77-90
Soiling Mechanisms and Performance of Anti-Soiling Surface Coatings....Pages 91-111
Implications of Particulate Contamination in the Performance of Floppy Disks....Pages 113-125
Front Matter....Pages 127-127
A Theoretical Review of Particle Adhesion....Pages 129-142
The Electrostatic Force on a Dielectric Sphere Resting on a Conducting Substrate....Pages 143-155
Electrostatic Charge Generation on Wafer Surfaces and its Effect on Particulate Deposition....Pages 157-168
Toner Adhesion in Electrophotography....Pages 169-177
Adhesion and Removal of Particles: Effect of Medium....Pages 179-191
Strong Adhesion of Dust Particles....Pages 193-199
Prevention of Strong Adhesion of Dust Particles....Pages 201-210
Dynamic Adhesion of Particles Impacting a Cylinder....Pages 211-224
Crossed Fiber Models of the Particle-Surface Interaction....Pages 225-236
Sensitive New Method for the Determination of Adhesion Force Between a Particle and a Substrate....Pages 237-243
Front Matter....Pages 245-245
Detection of Particles on Clean Surfaces....Pages 247-251
Front Matter....Pages 245-245
Detection of Particles Down to a “Few” Micrometers on Non-Specular Microelectronic Substrates and Other Surfaces....Pages 253-267
Accurate Particle Counting for Bare Substrate Inspection....Pages 269-291
Automated SEM/EDS Image Analysis of Particles on Filter Blanks....Pages 293-306
Particle Sizing and Counting with the Inspex EX20/20....Pages 307-326
Front Matter....Pages 327-327
Methods for Surface Particle Removal: A Comparative Study....Pages 329-338
Electrostatic Removal of Particles from Surfaces....Pages 339-349
Electric Field Detachment of Charged Particles....Pages 351-360
A New Approach to the Removal of Sub-Micron Particles from Solid (Silicon) Substrates....Pages 361-372
Back Matter....Pages 373-384
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