Ebook: Precision Assembly Technologies and Systems: 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Author: Jacob W. Chesna Stuart T. Smith D. J. Hastings Borja de la Maza (auth.) Svetan Ratchev (eds.)
- Tags: Simulation and Modeling, Nanotechnology and Microengineering, Manufacturing Machines Tools, Electronics and Microelectronics Instrumentation, Pattern Recognition, Image Processing and Computer Vision
- Series: IFIP Advances in Information and Communication Technology 371
- Year: 2012
- Publisher: Springer-Verlag Berlin Heidelberg
- Edition: 1
- Language: English
- pdf
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
Content:
Front Matter....Pages -
Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities....Pages 1-8
Semi-automated Assembly of a MEMS-Based Micro-scale CMM Probe and Future Optimization of the Process Chain with a View to Desktop Factory Automation....Pages 9-16
Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench....Pages 17-27
Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment....Pages 28-35
Processes for the Self-assembly of Micro Parts....Pages 36-41
Precisely Assembled Multi Deflection Arrays – Key Components for Multi Shaped Beam Lithography....Pages 42-50
Construction Kit for Miniaturised Handling Systems: Further Developments and First Applications....Pages 51-56
Flexible Gripper System for Small Optical Assemblies – Final Tests and Findings....Pages 57-64
Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments....Pages 65-72
Adhesive Workpiece Fixturing for Micromachining....Pages 73-80
Dual-Stage Feed Drive for Precision Positioning on Milling Machine....Pages 81-88
High Resolution Actuators for Severe Environments....Pages 89-96
Tolerance Management for Assembly – Not a Matter of Product Size....Pages 97-104
Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro-CMM....Pages 105-117
Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach....Pages 118-125
Accuracy Measurements of Miniature Robot Using Optical CMM....Pages 126-133
A System for the Quality Inspection of Surfaces of Watch Parts....Pages 134-143
Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding....Pages 144-153
Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System....Pages 154-162
Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data....Pages 163-174
Accelerated Ramp-Up of Assembly Systems through Self-learning....Pages 175-182
A Methodology for Assessing the Cost Effectiveness of Assembly Processes....Pages 183-190
Model Based Planning of Complex Micro-manufacturing Strategies....Pages 191-199
Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities....Pages 200-209
Back Matter....Pages -
This book constitutes the refereed proceedings of the 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, held in Chamonix, France, in February 2012. The 15 revised full papers were carefully reviewed and selected from numerous submissions. The papers are organized into the following topical sections: micro processes and systems; handling and manipulation in assembly; tolerance management and error compensation methods; metrology and quality control; intelligent control of assembly systems; and process selection and modelling techniques.
Content:
Front Matter....Pages -
Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities....Pages 1-8
Semi-automated Assembly of a MEMS-Based Micro-scale CMM Probe and Future Optimization of the Process Chain with a View to Desktop Factory Automation....Pages 9-16
Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench....Pages 17-27
Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment....Pages 28-35
Processes for the Self-assembly of Micro Parts....Pages 36-41
Precisely Assembled Multi Deflection Arrays – Key Components for Multi Shaped Beam Lithography....Pages 42-50
Construction Kit for Miniaturised Handling Systems: Further Developments and First Applications....Pages 51-56
Flexible Gripper System for Small Optical Assemblies – Final Tests and Findings....Pages 57-64
Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments....Pages 65-72
Adhesive Workpiece Fixturing for Micromachining....Pages 73-80
Dual-Stage Feed Drive for Precision Positioning on Milling Machine....Pages 81-88
High Resolution Actuators for Severe Environments....Pages 89-96
Tolerance Management for Assembly – Not a Matter of Product Size....Pages 97-104
Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro-CMM....Pages 105-117
Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach....Pages 118-125
Accuracy Measurements of Miniature Robot Using Optical CMM....Pages 126-133
A System for the Quality Inspection of Surfaces of Watch Parts....Pages 134-143
Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding....Pages 144-153
Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System....Pages 154-162
Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data....Pages 163-174
Accelerated Ramp-Up of Assembly Systems through Self-learning....Pages 175-182
A Methodology for Assessing the Cost Effectiveness of Assembly Processes....Pages 183-190
Model Based Planning of Complex Micro-manufacturing Strategies....Pages 191-199
Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities....Pages 200-209
Back Matter....Pages -
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