Ebook: Bonding in Microsystem Technology

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

This book concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching.

Such structures cannot be used directly, they must be designed and fabricated as a part of the three-dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book, which features a large number of illustrations, contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in Microsystems. There follows detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

This book concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching.

Such structures cannot be used directly, they must be designed and fabricated as a part of the three-dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book, which features a large number of illustrations, contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in Microsystems. There follows detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
Content:
Front Matter....Pages i-xviii
Introduction....Pages 1-1
Some Remarks on Microsystem Systematics and Development....Pages 3-13
Deep, Three-Dimensional Silicon Micromachining....Pages 15-118
Bonding....Pages 119-317
Classification of Bonding and Closing Remarks....Pages 319-331

This book concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching.

Such structures cannot be used directly, they must be designed and fabricated as a part of the three-dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book, which features a large number of illustrations, contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in Microsystems. There follows detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
Content:
Front Matter....Pages i-xviii
Introduction....Pages 1-1
Some Remarks on Microsystem Systematics and Development....Pages 3-13
Deep, Three-Dimensional Silicon Micromachining....Pages 15-118
Bonding....Pages 119-317
Classification of Bonding and Closing Remarks....Pages 319-331
....