Ebook: Low Dielectric Constant Materials for IC Applications

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Content:
Front Matter....Pages I-XIX
Overview on Low Dielectric Constant Materials for IC Applications....Pages 1-21
Materials Issues and Characterization of Low-k Dielectric Materials....Pages 23-74
Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering....Pages 75-93
Vapor Deposition of Low-k Polymeric Dielectrics....Pages 95-119
Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials....Pages 121-166
Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity....Pages 167-202
Metal/Polymer Interfacial Interactions....Pages 203-220
Diffusion Of Metals In Polymers And During Metal/Polymer Interface Formation....Pages 221-251
Plasma Etching of Low Dielectric Constant Materials....Pages 253-276
Integration of SiLK Semiconductor Dielectric....Pages 277-304
Back Matter....Pages 305-309

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Content:
Front Matter....Pages I-XIX
Overview on Low Dielectric Constant Materials for IC Applications....Pages 1-21
Materials Issues and Characterization of Low-k Dielectric Materials....Pages 23-74
Structure and Property Characterization of Low-k Dielectric Porous Thin Films Determined by X-Ray Reflectivity and Small-Angle Neutron Scattering....Pages 75-93
Vapor Deposition of Low-k Polymeric Dielectrics....Pages 95-119
Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials....Pages 121-166
Porous Organosilicates for On-Chip Applications: Dielectric Generational Extendibility by the Introduction of Porosity....Pages 167-202
Metal/Polymer Interfacial Interactions....Pages 203-220
Diffusion Of Metals In Polymers And During Metal/Polymer Interface Formation....Pages 221-251
Plasma Etching of Low Dielectric Constant Materials....Pages 253-276
Integration of SiLK Semiconductor Dielectric....Pages 277-304
Back Matter....Pages 305-309
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