Ebook: Electrothermal Analysis of VLSI Systems

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

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Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

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Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Content:
Front Matter....Pages i-xxi
Introduction....Pages 3-19
Power Analysis for CMOS Circuits....Pages 21-43
Temperature-dependent MOS Device Modeling....Pages 45-59
Thermal Simulation for VLSI Systems....Pages 61-93
Fast-timing Electrothermal Simulation....Pages 95-117
Temperature-dependent Electromigration Reliability....Pages 121-155
Temperature-driven Cell Placement....Pages 157-179
Temperature-driven Power and Timing Analysis....Pages 181-202
Back Matter....Pages 203-210

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Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Content:
Front Matter....Pages i-xxi
Introduction....Pages 3-19
Power Analysis for CMOS Circuits....Pages 21-43
Temperature-dependent MOS Device Modeling....Pages 45-59
Thermal Simulation for VLSI Systems....Pages 61-93
Fast-timing Electrothermal Simulation....Pages 95-117
Temperature-dependent Electromigration Reliability....Pages 121-155
Temperature-driven Cell Placement....Pages 157-179
Temperature-driven Power and Timing Analysis....Pages 181-202
Back Matter....Pages 203-210
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