Ebook: Multi-Chip Module Test Strategies

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs.
Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

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MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs.
Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

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MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs.
Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Content:
Front Matter....Pages 1-6
Fundamentals of MCM Testing and Design-for-Testability....Pages 7-14
Known Good Die....Pages 15-25
A Survey of Test Techniques for MCM Substrates....Pages 27-38
Smart Substrate MCMs....Pages 39-53
Electron Beam Probing—A Solution for MCM Test and Failure Analysis....Pages 55-63
MCM Test Strategy Synthesis from Chip Test and Board Test Approaches....Pages 65-76
Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules....Pages 77-86
An Effective Multi-Chip BIST Scheme....Pages 87-95
Design-for-Test in a Multiple Substrate Multichip Module....Pages 97-108
A Test Methodology for High Performance MCMs....Pages 109-118
A Formalization of the IEEE 1149.1–1990 Diagnostic Methodology as Applied to Multichip Modules....Pages 119-125
Multichip Module Diagnosis by Product-Code Signatures....Pages 127-135
Simulation Techniques for the Manufacturing Test of MCMs....Pages 137-149
Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die....Pages 151-166
Back Matter....Pages 167-167

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MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs.
Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.
Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Content:
Front Matter....Pages 1-6
Fundamentals of MCM Testing and Design-for-Testability....Pages 7-14
Known Good Die....Pages 15-25
A Survey of Test Techniques for MCM Substrates....Pages 27-38
Smart Substrate MCMs....Pages 39-53
Electron Beam Probing—A Solution for MCM Test and Failure Analysis....Pages 55-63
MCM Test Strategy Synthesis from Chip Test and Board Test Approaches....Pages 65-76
Designing “Dual Personality” IEEE 1149.1 Compliant Multi-Chip Modules....Pages 77-86
An Effective Multi-Chip BIST Scheme....Pages 87-95
Design-for-Test in a Multiple Substrate Multichip Module....Pages 97-108
A Test Methodology for High Performance MCMs....Pages 109-118
A Formalization of the IEEE 1149.1–1990 Diagnostic Methodology as Applied to Multichip Modules....Pages 119-125
Multichip Module Diagnosis by Product-Code Signatures....Pages 127-135
Simulation Techniques for the Manufacturing Test of MCMs....Pages 137-149
Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die....Pages 151-166
Back Matter....Pages 167-167
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