Ebook: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Author: Xing-Chang Wei
- Tags: Microprocessor Design, Microprocessors & System Design, Hardware & DIY, Computers & Technology, Design, Circuits, Electrical & Electronics, Engineering, Engineering & Transportation, Microwaves, Telecommunications & Sensors, Engineering, Engineering & Transportation, Computer Science, Algorithms, Artificial Intelligence, Database Storage & Design, Graphics & Visualization, Networking, Object-Oriented Software Design, Operating Systems, Programming Languages, Software Design & Engineering, New Used & Rental Textbooks
- Year: 2017
- Publisher: CRC Press
- Edition: 1
- Language: English
- pdf
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.