Online Library TheLib.net » Through silicon vias: materials, models, design, and performance
cover of the book Through silicon vias: materials, models, design, and performance

Ebook: Through silicon vias: materials, models, design, and performance

00
27.01.2024
0
0

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Download the book Through silicon vias: materials, models, design, and performance for free or read online
Read Download
Continue reading on any device:
QR code
Last viewed books
Related books
Comments (0)
reload, if the code cannot be seen